Materials supply
- Substrates and epi structures Si, GaN, SiC (4H, 6H).
- Test Sockets for all package types (QFP, BGA, PBGA etc).
- Trays and packaging for die, wafers, packages etc.
- Leadframes for ICs (DIP, SO, SOIC и т.д.) and semiconductor devices (TO220, D2PAK etc.).
- Metallized ceramics BeO, AlN, Al2O3.
- Materials for assembly of ICs and semiconductor devices.
- Foundry
- Assembly
- Equipment supply
- Materials supply
- Delivery of packages for ICs, Microwave, Semiconductor and Оptoelectronic devices
- Sockets for IC and semiconductor devices
- Development of IC and Semiconductor Devices