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Open Cavity Plastic Package
Open Cavity Plastic Package
Type | Number of leads | Lead pitch | Body size | Picture |
---|---|---|---|---|
Air Cavity Plastic SOIC (Dimensions in inches) | 8-28 | .050 | .150 - .300 | |
Pre-molded PLCC Package (Dimensions in inches) | 44 - 68* | 0.050 | .650 -.950 sq | |
Pre-molded TQFP / LQFP Package (Dimensions in millimeters) | 32 - 208 | 0.50 - 0.80 | 7 x 7 - 28 x 28* | |
Pre-molded Cavity QFN Package (Dimensions in millimeters) | 28 - 64 | 0.50 | 5 x 5 -9 x 9 |
Plastic RF Power LDMOS Transistors, Power Amplifiers Package | High Temperature Stability (500C) |
- Foundry
- Assembly
- Equipment supply
- Materials supply
- Delivery of packages for ICs, Microwave, Semiconductor and Оptoelectronic devices
- Sockets for IC and semiconductor devices
- Development of IC and Semiconductor Devices